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Industrial
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- Comparison of Mold Alloy Properties
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- Technical Paper - Cooling Prediction
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- Wear Research To Compare Copper Molds To Steel
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- Applications
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- Electronic Connector Design Guide
- Mold Design Guidelines
Initial Stress Level
Photo ©1998 AMP INC. Although time and temperature are usually determined by the expected application of a connector, with a suitable choice of contact alloy the loss of contact force over design life can be curtailed. By management of three secondary variables, the loss of contact force over time can be further reduced. The secondary variables are: initial stress level, orientation, and temper.
The rate of stress relaxation is influenced by the initial stress (Si). If the beam is initially deflected such that it is stressed at its yield strength, then rapid loss of contact force may occur. If the stress is only 20% of the yield strength, practically no loss occurs. Initial contact forces are such that applied stresses are commonly 30-90% of the metal's yield strength, and within that range the loss of contact force is almost invariant with Si. That's why stress relaxation testing is usually done with initial stress levels of 75% of the metal's yield strength.
Beyond the Basics - Performance Over Time
- Overview of Stress Relaxation
- Stress Relaxation Tests
- Alloy Selection for Stress Relaxation
- Time Affects Stress Relaxation
- Temperature Affects Stress Relaxation
- Initial Stress Level Affects Stress Relaxation
- Orientation Affects Stress Relaxation
- Temper Affects Stress Relaxation
- Fatigue Strength
- Factors Affecting Fatigue Strength
- Interface Corrosion
- Stress Corrosion Cracking (SCC)
- SCC Susceptable & Resistant Alloys
- Tin Coatings
- Tin Whiskers
- Copper-Tin Intermetallic Compounds
- Effect of Time and Temperature on Copper-Tin
- Contact Resistance When Using Tin Coatings
- Friction When Using Tin Coatings